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DC Field | Value | Language |
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dc.contributor.author | Z. Boumerzoug | - |
dc.contributor.author | Gareh Salim | - |
dc.contributor.author | Abdellatif Beribeche | - |
dc.date.accessioned | 2013-04-16T12:50:31Z | - |
dc.date.available | 2013-04-16T12:50:31Z | - |
dc.date.issued | 2013-04-16 | - |
dc.identifier.uri | http://archives.univ-biskra.dz/handle/123456789/2324 | - |
dc.description.abstract | The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Qc for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy. Link http://www.scirp.org/journal/PaperInformation.aspx?PaperID=25045#.U0uyklV5P78 | en_US |
dc.language.iso | en | en_US |
dc.subject | Copper, Creep, Drawn Wire, Heat Treatment. | en_US |
dc.title | Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper | en_US |
dc.type | Article | en_US |
Appears in Collections: | Publications Internationales |
Files in This Item:
File | Description | Size | Format | |
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Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper.pdf | 43,92 kB | Adobe PDF | View/Open |
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