Gestion des échanges thermiques des éléments électroniques

Abstract

A numerical simulation was proposed in this study in order to compare the effect of the nanofluid (water-Copper), the number of electronic components and the Reynolds number on the cooling of electronic components in a micro-channel, for this purpose a simulation software was used ANSYS Workbench, whose results have shown that the increase of electronic components requires the increase of the number of Reynolds in a fluid causes an improvement of the convective heat exchange. Keys words: Nanofluid, convection, Cooling electronic components.